Plating Technology, Inc.

LEI 254900U2ON4Y9O9OM906

Legal Address


c/o JODY P. BLAZER
1525 W. RIVER ROAD
DAYTON US-OH US 45417

Headquarters Address


1525 West River Road
Dayton US-OH US 45417

LEI Registration Details
L E I
254900U2ON4Y9O9OM906
Legal Name
Plating Technology, Inc.
Authority Authority I D
RA000629
Authority Authority I D
231403
Legal Jurisdiction
US-OH
Legal Form Legal Form Code
BTQ1
Status
ACTIVE
Initial Date
2020-03-25 17:04:24
Last Update Date
2020-03-25 21:04:24
Status
ISSUED
Next Renewal Date
2021-03-25 17:04:24
Managing L O U
5493001KJTIIGC8Y1R12 [Bloomberg Finance L.P.]
Validation Sources
PARTIALLY_CORROBORATED
Validation Authority Validation Authority I D
RA000629
Validation Authority Validation Authority I D
231403

LEI Registration Exception(s)



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